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Epoxy resin potting glue
Epoxy resin potting glue

SD 6108 Two-component silicone filling gel 10:1

Brand: SANDAO
MOQ: 1000 Pieces
Delivery time: 15 Day
◆ Features: The product is cross-linked by forming a high performance elastomer; superior performance, stable quality, good hou resistance, durable adhesion, rubber elasticity within-60~200℃, excellent insulation performance, yellow degeneration resistance (yellow resistance for more than 1 year); it is an ideal material for LED display screen, three circuit boards and module sealing. ◆ Environmental protection requirements: meet the RoHS directive and related environmental protection requirements
Product Details

◆Product model: SD6108 Two-component silicone sealing adhesive        

◆Features: This product is cross-linked by condensation, forming a high performance elastomer; superior performance, stable quality, good hou resistance, durable adhesion, rubber elasticity within-60~200℃, excellent insulation performance, yellow degeneration resistance (yellow resistance for more than 1 year); it is an ideal material for LED display screen, circuit board three prevention and module sealing.

◆Environmental requirements: comply with RoHS Directive and relevant environmental requirements  

■ Appliance

Application in general electronic components, power modules and printed circuit boards, waterproof, high voltage resistance, and automotive electrical appliances.

 Technical parameter

function

surveillance project

surveillance project

surveillance project

After mixing the color

surface(A)

visualization

Transparent flowing body

surface(B)

visualization

Light yellow or colorless flow body

After mixing the color

visualization

transparent

The viscosity of component A mPa·s

GB/T 2794

1000~1500

The viscosity of component B mPa·s

GB/T 2794

20~30

hold do nature ability

Two-component mixing ratio

(weight ratio)A:B

10 :1

After mixing viscosity mPa·s

GB/T 2794

800~1500

After mixing viscosity min

GB/T 7123.1

30~60

Preliminary curing timeH

GB/T 7123.1

6~8

Complete curing time, H

GB/T 7123.1

24

Relative specific gravity of g/cm³

GB/T13477.2

1.0±0.1

firm spend behind

Hardness

shoreA

GB/T 531

15~30

dielectric strength kV/mm

GB/T 1694

≥20

dielectric constant 1MHz

GB/T 1694

≥2.8

mass resistivityΩ·cm  

GB/T 1692

 ≥1.0×1015

tensile strength  MPa

GB/T 528

≥0.8

80℃  144h)

 

tensile strength

Use the temperature range

/

-60℃~200℃

Use the temperature range

 

transparent

 

 Use method and matters needing attention

※Gel time adjustment: increase or decrease the proportion of component A / B, which can prolong or shorten the gel time of the product, fine tuning as needed; with the proportion of A / B, oil production or incomplete curing; with the proportion of A / B, the adhesive will harden, elasticity decreases, or be corrosive to the plastic kit; Blade: use manual or machine to fully mix the glue evenly, so that the glue is the same color. The use of manual glue filling process should pay attention to the amount of one-time glue can not be too much, so as not to reduce the fluidity in the later stage is difficult to fill the glue;

※Seal: The device surfaces and mixed containers shall be kept clean and dry before sealing.

※Curing: Before the small molecules produced in the curing process are completely released, the device should not seal the sealing device completely and add high temperature. If the sealing is completely required, the device must be exposed to air after using the product, and can be sealed for more than 7 days.

※This product is a non-dangerous goods, but do not enter and eyes.

※Store in a cool and dry place, avoid rain and exposure, and last six months under 26℃ unopened conditions.

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